Patent Number: 6,332,751

Title: Transfer device centering method and substrate processing apparatus

Abstract: In centering a transfer device so that tweezers of the transfer device transfer a substrate to a predetermined delivery position on a spin chuck when the substrate is delivered to a coating unit by means of the transfer device, the substrate is transferred onto the spin chuck in the coating unit by means of the tweezers, a positional deviation amount of the substrate with respect to the delivery position on the chuck is detected by a detecting device, a positional deviation amount of the tweezers is computed based on this detection value, and a position at which the tweezers deliver the substrate is corrected based on the positional deviation amount of the tweezers. Thus, centering of the substrate transfer device can be performed automatically in a short time.

Inventors: Kozawa; Seiji (Uto, JP), Iida; Naruaki (Kumamoto, JP), Ookura; Jun (Kumamoto, JP)

Assignee: Tokyo Electron Limited

International Classification: B65H 9/20 (20060101); B65H 9/00 (20060101); B65H 009/00 (); B65H 009/20 (); G03D 005/00 ()

Expiration Date: 12/25/2018