Patent Number: 6,332,766

Title: Apparatus for encasing array packages

Abstract: The upper and lower mold plates of a transfer molding machine areconfigured for one-side encapsulation of a pair of substrate mountedelectronic devices having an opposite conductor-grid-array and/or bareheat sink/dissipator. The pair of devices is positioned back-to-backwithin a single mold cavity for simultaneous encapsulation. A buffermember, optionally with cut-outs or apertures, may be placed between thetwo back-to-back substrates for protecting the grid-arrays and enablingencapsulation of devices with varying thicknesses without adjustment ofthe molding machine. Alternately, the upper and lower plates areconfigured for one-side encasement using covers of a pair of substratemounted electronic devices having an opposite conductor-grid-array and/orbare heat sink/dissipator.

Inventors: Thummel; Steven G. (Boise, ID)

Assignee:

International Classification: B29C 45/14 (20060101); H01L 21/56 (20060101); H01L 21/02 (20060101); H05K 3/28 (20060101); H05K 3/00 (20060101); B29C 033/12 ()

Expiration Date: 12/25/2014