Patent Number: 6,332,770

Title: Apparatus for localized preform cooling outside the mold

Abstract: An apparatus and method for providing targeted cooling to a pre-molded article, such as a preform. A cooling pin is inserted into the preform such that it makes contact with targeted area, such as the mold gate area. This permits conductive cooling of the targeted area. The apparatus and method are particularly suited to post-mold cooling in conjunction with a robotic take-out plate.

Inventors: Oueslati; Faisal (Mississauga, CA), Brand; Tiemo (North York, CA), Neter; Witold (Newnan, GA)

Assignee: Husky Injection Molding Systems, Ltd.

International Classification: B29C 45/72 (20060101); B29C 045/72 ()

Expiration Date: 12/25/2018