Patent Number: 6,332,782

Title: Spatial transformation interposer for electronic packaging

Abstract: An interconnect substrate structure for electrical interconnection between two electronic modules having differing conductive array parameters. The interconnect structure comprises an interposer having a top surface and a bottom surface; a first set of conductive arrays having a first conductive array parameter on the top surface, and a second set of conductive arrays having a second conductive array parameter on the bottom surface, the second conductive array and the first conductive array having differing parameters. A plurality of conductors traverses a thickness of the interposer, with the conductors comprising a conductive material optionally coated with a dielectric material, the conductors having a first end at the first conductive arrays and a second end at the second conductive arrays, whereby the conductors connecting the first and second conductive arrays therein are adapted to spatially transform the differing parameters to provide an electrical interconnection. A conductive matrix surrounds the conductors. The first set of conductive arrays comprise the same conductive array parameters as a first electronic module and the second set of conductive arrays comprise the same conductive array parameters as a second electronic module.

Inventors: Bezama; Raschid J. (Mahopac, NY), Natarajan; Govindarajan (Pleasant Valley, NY), Pasco; Robert W. (Wappinger Falls, NY)

Assignee: International Business Machines Corporation

International Classification: H05K 7/10 (20060101); H05K 1/14 (20060101); H01R 13/24 (20060101); H01R 13/22 (20060101); H05K 3/34 (20060101); H05K 1/11 (20060101); H05K 3/36 (20060101); H01R 012/00 ()

Expiration Date: 12/25/2018