Patent Number: 6,332,826

Title: Polishing apparatus

Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

Inventors: Katsuoka; Seiji (Kanagawa, JP), Tsujimura; Manabu (Kanagawa, JP), Sakurai; Kunihiko (Kanagawa, JP), Osawa; Hiroyuki (Kanagawa, JP)

Assignee: Ebara Corporation

International Classification: B24B 27/00 (20060101); B24B 37/04 (20060101); B24B 53/007 (20060101); B24B 49/12 (20060101); B24B 049/00 ()

Expiration Date: 12/25/2018