Patent Number: 6,332,828

Title: Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat

Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.

Inventors: Hasegawa; Fumihiko (Nishigou-mura, JP), Kuroka; Yasuyoshi (Nishigou-mura, JP), Tsuchiya; Toshihiro (Nishigou-mura, JP), Ichikawa; Koichiro (Nagano, JP), Inada; Yasuo (Nagano, JP)

Assignee: Shin-Etsu Handotai Co., Ltd.

International Classification: B24B 49/02 (20060101); B24B 49/12 (20060101); B24B 9/06 (20060101); B24B 009/06 ()

Expiration Date: 12/25/2018