Patent Number: 6,332,830

Title: Polishing method and polishing device

Abstract: A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2).

Inventors: Okamura; Kouichi (Nishishirakawa, JP), Suzuki; Fumio (Nishishirakawa, JP), Masumura; Hisashi (Nishishirakawa, JP)

Assignee: Shin-Etsu Handotai Co., Ltd.

International Classification: B24D 9/00 (20060101); B24D 9/08 (20060101); B24B 37/04 (20060101); B24B 41/00 (20060101); B24B 41/047 (20060101); B24B 001/00 ()

Expiration Date: 12/25/2018