Patent Number: 6,332,832

Title: CMP polish pad and CMP processing apparatus using the same

Abstract: A CMP polish pad used to chemically and mechanically polish a work to be polished. The CMP polish pad has polishing portions of two or more types, that have different conditions of contact with the work, provided on the pad surface. For example, polishing portions of a plurality of types having different coefficients of elasticity with respect to compression in the direction of pressing against the work may be provided on the pad surface. Also polishing portions of a plurality of types having different areas of contact with the work may be provided on the pad surface. Further, polishing portions of a plurality of types having different heights above the pad surface may be provided on the pad surface.

Inventors: Suzuki; Keisuke (Kyoto, JP)

Assignee: Rohm Company, Ltd.

International Classification: B24D 7/00 (20060101); B24D 7/14 (20060101); B24B 37/04 (20060101); B23F 021/03 ()

Expiration Date: 12/25/2018