Patent Number: 6,333,135

Title: Laminate film and processes for preparing printed wiring board

Abstract: Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80.degree. C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.

Inventors: Kimura; Noriyo (Hitachi, JP), Tanaka; Youji (Hitachi, JP), Masaoka; Kazutaka (Hitachi, JP), Kudou; Takafumi (Sagamihara, JP), Minamihira; Yukihiko (Sagamihara, JP), Yoshida; Tetsuo (Sagamihara, JP)

Assignee: Hitachi Chemical Co., Ltd.

International Classification: G03F 7/09 (20060101); G03F 7/16 (20060101); H05K 3/06 (20060101); H05K 3/00 (20060101); G03F 007/09 ()

Expiration Date: 12/25/2018