Patent Number: 6,333,209

Title: One step method for curing and joining BGA solder balls

Abstract: A one step method for curing encapsulant and joining Ball Grid Array (BGA) solder balls comprises curing an encapsulant material simultaneously with the joining of the eutectic material of the apparatus whether that eutectic material is a solder paste or preform, the balls being of a higher melt material or the balls themselves being an eutectic material. The method performs both functions in one pass through a furnace avoiding the separate and time consuming encapsulant and/or underfill curing step.

Inventors: Coico; Patrick A. (Fishkill, NY), Covell; James H. (Poughkeepsie, NY), Goldmann; Lewis S. (Bedford, NY), Kelly; Kimberly A. (Pleasant Valley, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/56 (20060101); H01L 21/02 (20060101); H01L 021/48 ()

Expiration Date: 12/25/2018