Patent Number: 6,333,253

Title: Pattern-block flux deposition

Abstract: A method and apparatus are provided for selectively depositing flux on a plurality of flip-chip bumps arranged on a semiconductor by mounting a flux stamp on the semiconductor chip. The flux stamp has a plurality of flux holes arranged in a pattern substantially identically corresponding to the arrangement of the flip-chip bumps of the semiconductor chip. Different flux stamps are prepared for various kinds of semiconductor chips having different flip-chip bump arrangements. Flux is deposited though the flux holes of the flux stamp which selectively exposing the upper surfaces of the flip-chip bumps of the chip, thereby leaving no flux on the chip surface between the flip-chip bumps.

Inventors: Brownfield; Terri J. (Boulder Creek, CA), Master; Raj N. (San Jose, CA)

Assignee: Advanced Micro Devices, Inc.

International Classification: B23K 1/20 (20060101); B23K 3/08 (20060101); B23K 3/00 (20060101); H01L 21/60 (20060101); H01L 21/02 (20060101); H05K 3/34 (20060101); H01L 021/44 ()

Expiration Date: 12/25/2018