Patent Number: 6,333,466

Title: Flexible wiring board

Abstract: A flexible wiring board which exhibits a sufficient flex life under high temperature working conditions. The flexible wiring board comprises an insulation layer provided on both surfaces of a conductor layer, optionally with an adhesive layer provided interposed therebetween, wherein the layers being in direct contact with both surfaces of the conductor layer exhibit an average complex shear modulus value of from 1.0.times.10.sup.10 to 4.times.10.sup.10 dyn/cm.sup.2 at a temperature of 60.degree. C. and a frequency of 25 Hz.

Inventors: Miyaake; Chiharu (Osaka, JP), Miyake; Yasufumi (Osaka, JP), Terada; Tetsuya (Osaka, JP)

Assignee: Nitto Denko Corporation

International Classification: B32B 7/12 (20060101); H05K 3/28 (20060101); H05K 001/00 ()

Expiration Date: 12/25/2018