Patent Number: 6,333,550

Title: Surface mount semiconductor diode device

Abstract: A surface mount semiconductor diode device (50) having first (51) and second (53) coplanar contacts comprises a semiconductor element (52) having a first surface electrically mounted on a first member (54) formed of conductive material, which first member (54) has an arm (58) extending in a direction away from the semiconductor element (52) to an end (60) which forms the first contact (51). A cup member (62) formed of conductive material comprises a wall (64) extending from a bottom portion (66) so as to form an opening (68) surrounded by the wall (64). The semiconductor element (52) and first member (54) are mounted within the opening (68) such that a second surface of the semiconductor element (52) is electrically coupled to the bottom portion (66) of the cup member (62) and the end of the arm (58) extends above a top surface (72) of the wall (64). The cup member (62) further comprises a leg portion (74) integral with and extending from the top surface of the wall (64) such that an end (76) of the leg portion (74) is coplanar with the end of the arm, and forms the second contact (53).

Inventors: Martin; Jean-Baptiste (Toulouse, FR), Wasmer; William D. (Toulouse, FR)

Assignee: Semiconductor Components Industries LLC

International Classification: H01L 23/495 (20060101); H01L 23/051 (20060101); H01L 23/02 (20060101); H01L 23/48 (20060101); H01L 023/48 ()

Expiration Date: 12/25/2018