Patent Number: 6,396,154

Title: Semiconductor device

Abstract: A semiconductor device having a chip-on-chip structure in which a semiconductor chip having a connecting pad formed on its surface and a surface movable element overlapped with and joined to the surface of the semiconductor chip are overlapped with each other. The surface movable element has a movable element and a connecting pad on its surface opposite to the semiconductor chip. The connecting pad on the surface of the semiconductor device and the connecting pad on the surface of the surface movable element are connected to each other through a pad joint. The pad joint ensures an operating space for allowing an operation of moving the movable element between the semiconductor chip and the surface movable element. The movable element may be a surface acoustic wave element.

Inventors: Hikita; Junichi (Kyoto, JP), Mochida; Hiroo (Kyoto, JP)

Assignee: Rohm Co., LTD

International Classification: H01L 23/48 (20060101); H01L 23/495 (20060101); H01L 023/48 (); H01L 023/52 (); H01L 029/40 ()

Expiration Date: 05/28/2019