Patent Number: 6,396,155

Title: Semiconductor device and method of producing the same

Abstract: A semiconductor device includes a semiconductor element on which aplurality of bumps are formed and a substrate having a first surface onwhich a plurality of protruding electrodes are protrudingly formed incorrespondence to an arrangement of the bumps, and a second surface onwhich balls serving as mounting terminals are formed. The semiconductorelement is bonded in a face-down manner to the substrate with theprotruding electrodes being embedded into the bumps. Alloy layers havingmaterials identical to those of the bumps and the protruding electrodesare formed on interfaces of the bumps and the protruding electrodes.

Inventors: Nukiwa; Masaru (Kawasaki, JP), Iijima; Makoto (Kawasaki, JP), Ueno; Seiji (Kawasaki, JP), Morioka; Muneharu (Kawasaki, JP)

Assignee:

International Classification: H01L 21/02 (20060101); H01L 23/485 (20060101); H01L 23/48 (20060101); H01L 21/56 (20060101); H01L 23/498 (20060101); H01L 023/48 ()

Expiration Date: 05/28/2014