Patent Number: 6,396,294

Title: Socket pin and socket for electrical testing of semiconductor packages

Abstract: A socket pin and a socket for electrical testing of a semiconductor package suppress electrical open/short defects due to contact failure and reduce manufacturing costs. The socket pin includes: an upper portion that connects to a lead of the semiconductor package, for exchanging a signal between the semiconductor package and a tester; a body connected to the upper portion, for buffering at two points, a downward force applied by the lead of the semiconductor package to the upper portion; a lower portion connected to the body of the socket pin, the lower portion being elastically durable to the force from the upper portion and the body; and a lower socket pin connected to the lower portion, which acts as a path for transmitting or receiving an electrical signal.

Inventors: An; Young-soo (Chungcheongnam-do, KR), Lee; Young-moon (Chungcheongnam-do, KR), Lee; Jae-il (Chungcheongnam-do, KR), Chae; Hyo-geun (Chungcheongnam-do, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: G01R 1/04 (20060101); G01R 1/02 (20060101); G01R 001/04 ()

Expiration Date: 05/28/2019