Patent Number: 6,401,008

Title: Semiconductor wafer review system and method

Abstract: A semiconductor wafer review system and method. A method and system for front and back side review of semiconductor wafers is provided in various embodiments. Inspection data for the front side is used to position the wafer for front side review, and a wafer inverter is provided to flip the wafer for back side review. Inspection data for the back side is used to position the wafer for back side review.

Inventors: Ehrichs; Edward E. (Austin, TX), Wooten; Chris (Austin, TX)

Assignee: Advanced Micro Devices, Inc.

International Classification: G01N 21/95 (20060101); G01N 21/88 (20060101); H01L 21/00 (20060101); H01L 21/68 (20060101); H01L 21/67 (20060101); H01L 21/687 (20060101); G06F 007/00 ()

Expiration Date: 06/04/2019