Patent Number: 6,426,556

Title: Reliable metal bumps on top of I/O pads with test probe marks

Abstract: A new method is provided for the creation of metal bumps over surfaces of I/O pads. The area in the surface of I/O pads, which have been used for I/O pads during wafer level semiconductor device testing, is removed in the immediate vicinity of the surface area where the test probe contacts the I/O pad. This removal uses methods of metal dry etching or wet etching.

Inventors: Lin; Mou-Shiung (Hsinchu, TW)

Assignee: MEGIC Corporation

International Classification: H01L 21/60 (20060101); H01L 23/48 (20060101); H01L 23/485 (20060101); H01L 21/02 (20060101); H01L 023/48 ()

Expiration Date: 07/30/2019