Patent Number: 6,429,094

Title: Treatment process for molecular bonding and unbonding of two structures

Abstract: Process for providing separable structures comprising providing at least two structures wherein at least one structure contains a diffusable element contacting said structures under conditions providing molecular bonding of said structures along a bonding interface and heating said bonded structures under conditions causing diffusion of the diffusable element to the bonding interface where said diffusable element interacts with the bonding interface enabling the unbounding of said structures along the bonding interface. This process is useful in the manufacture of devices with integrated circuits.

Inventors: Maleville; Christophe (Bernin, FR), Aspar; Bernard (Rives, FR)

Assignee: Commissariat A l'Energie Atomique

International Classification: H01L 21/68 (20060101); H01L 21/603 (20060101); H01L 21/67 (20060101); H01L 21/02 (20060101); H01L 021/30 (); H01L 021/46 ()

Expiration Date: 08/06/2019