Patent Number: 6,429,383

Title: Apparatus and method for improving circuit board solder

Abstract: A circuit board includes electrical interconnect mounting pads for mounting electronic devices thereto. Some of the electrical interconnect mounting pads include a plated through hole which traverses through the circuit board. One end of the plated through holes is closed, plugged or covered to prevent migration of solder through the plated through holes during a solder operation. The reduction in solder migration, as a result of plugging the plated through hole, increases solder joint quality over solder joint quality achieved using plated through holes which are not closed at one end.

Inventors: Sprietsma; John T. (Hillsboro, OR), Joy; Steve (Portland, OR), Horine; Bryce (Aloha, OR)

Assignee: Intel Corporation

International Classification: H05K 3/00 (20060101); H05K 1/11 (20060101); H05K 3/34 (20060101); H05K 001/16 ()

Expiration Date: 08/06/2019