Patent Number: 6,429,506

Title: Semiconductor device produced by dicing

Abstract: A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.

Inventors: Fujii; Tetsuo (Toyohashi, JP), Fukada; Tsuyoshi (Aichi-gun, JP), Muto; Hiroshi (Nagoya, JP), Ao; Kenichi (Tokai, JP), Yoshihara; Shinji (Nagoya, JP), Inomata; Sumitomo (Toyota, JP)

Assignee: Denso Corporation

International Classification: B81C 1/00 (20060101); H01L 21/68 (20060101); H01L 21/67 (20060101); H01L 021/301 ()

Expiration Date: 08/06/2019