Patent Number: 6,444,923

Title: Method of connecting printed wiring boards with each other, and printed circuit board

Abstract: At one end of a printed wiring board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. At one end of an FPC which is to be connected with the printed circuit board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. The engagement patterns in the printed wiring board being engageable with the engagement patterns in the FPC. When the two engagement patterns are engaged with each other, the electrode pattern of the printed wiring board is electrically connected with the electrode pattern of the FPC.

Inventors: Iriguchi; Shigeo (Kanagawa, JP), Watanabe; Satoshi (Kanagawa, JP), Muraoka; Yoshitaka (Kanagawa, JP)

Assignee: Fujitsu Limited

International Classification: H05K 3/36 (20060101); H05K 3/24 (20060101); H05K 3/34 (20060101); H01R 009/09 ()

Expiration Date: 09/03/2019