Patent Number: 6,480,370

Title: Polymeric dielectric material for high-energy density capacitors

Abstract: The present invention includes a dielectric. The dielectric comprises a polymer that has a high dielectric constant. The polymer comprises polarizable species. The present invention also includes an embedded capacitor, and an IC package made with the dielectric.

Inventors: Koning; Paul A. (Chandler, AZ), Wermer; Paul H. (San Francisco, CA)

Assignee: Intel Corporation

International Classification: C07D 487/00 (20060101); C07D 487/22 (20060101); C09B 47/04 (20060101); C09B 47/08 (20060101); H01G 4/18 (20060101); H01B 3/30 (20060101); H01G 4/14 (20060101); H05K 1/16 (20060101); H01G 004/06 ()

Expiration Date: 11/12/2019