Patent Number: 6,480,395

Title: Device and method for interstitial components in a printed circuit board

Abstract: A printed circuit board (PCB) includes a first layer having first and second surfaces, with an above-board device mounted thereon. The PCB includes a second layer having third and fourth surfaces. One of the surfaces can include a recessed portion for securedly holding an interstitial component. A via, electrically connecting the PCB layers, is also coupled to a lead of the interstitial component.

Inventors: Kopf; Dale R. (Middleton, ID)

Assignee: Hewlett-Packard Company

International Classification: H05K 1/18 (20060101); H05K 1/02 (20060101); H05K 3/46 (20060101); H05K 007/02 ()

Expiration Date: 11/12/2019