Patent Number: 6,480,751

Title: Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods

Abstract: High-speed high-reliability component supplying method and mounting method is obtained by checking whether or not a component is the regular component to be mounted through a component type detecting process by means of component arrangement data having a plurality of substitute component type names of components which can be mounted in the proper position of a component supply section and a detection section and a comparing and deciding process.

Inventors: Kuribayashi; Takeshi (Yamanashi, JP), Nonaka; Satoshi (Yamanashi, JP), Imafuku; Shigeki (Nieasaki, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: H05K 13/00 (20060101); H05K 13/04 (20060101); H05K 13/08 (20060101); G05B 019/18 ()

Expiration Date: 11/12/2019