Patent Number: 6,486,538

Title: Chip carrier having ventilation channels

Abstract: A chip carrier made of a non-metallic material has conductor tracks applied thereon for producing an external, two-dimensional connection configuration for electronic circuit chips. The chip carrier has a multiplicity of chip mounting locations and first cutouts disposed in such a way that at least one first cutout is adjacent each of the chip mounting locations. A second, channel-like cutout in the chip carrier leads from each chip mounting location to a first cutout adjacent the chip mounting location.

Inventors: Reiss; Martin (Regensburg, DE), Winderl; Johann (Wackersdorf, DE)

Assignee: Infineon Technologies AG

International Classification: H01L 23/12 (20060101); H01L 25/065 (20060101); H01L 23/13 (20060101); H01L 023/495 ()

Expiration Date: 11/26/2019