Patent Number: 6,490,296

Title: Multi-link segmentation and reassembly for bonding multiple PVC's in aninverse multiplexing arrangement

Abstract: Systems and methods are described for multi-link segmentation andreassembly for bonging multiple virtual circuits in an inversemultiplexing arrangement. A method includes: generating a plurality ofmultilink segmentation and reassembly sublayer cells at a first location;distributing the plurality of multilink segmentation and reassemblysublayer cells across a plurality of virtual circuits; transmitting theplurality of multilink segmentation and reassembly sublayer cells to asecond location via the plurality of virtual circuits; and receiving theplurality of multilink segmentation and reassembly sublayer cells at thesecond location. An apparatus includes a multilink segmentation andreassembly sublayer transmitter, including: a source buffer; a multilinkcontroller coupled to the source buffer; and a plurality of virtualcircuits coupled to the multilink controller.

Inventors: Shenoi; Kishan (Saratoga, CA), Jacobsen; Gary (San Jose, CA), Kraba; Kamila (Santa Clara, CA), Lai; Chien-Chou (Sunnyvale, CA), Sommer; Jeremy (Mountain View, CA), Yang; Jining (Sunnyvale, CA)

Assignee:

International Classification: H04L 12/56 (20060101); H04Q 11/04 (20060101); H04J 003/16 ()

Expiration Date: 12/02015