Patent Number: 6,512,180

Title: Printed-wiring board, method for identifying same, and method for manufacturing same

Abstract: A printed-wiring board to be mounted with a circuit element includes a plurality of pads which assist in an electric connection between the circuit element and a wiring pattern, at least one of said plurality of pads being used to serve as an identifier for identifying the printed-wiring board.

Inventors: Nakagawa; Hisatsuna (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: H01L 23/544 (20060101); H05K 1/11 (20060101); H05K 1/02 (20060101); H05K 3/34 (20060101); H05K 001/02 ()

Expiration Date: 01/28/2020