Patent Number: 6,512,196

Title: Laser cutting device and method for cutting glass substrate by using the same

Abstract: Laser cutting device for cutting a glass substrate of a liquid crystal display, and methods for cutting a glass substrate using that device. The device includes a vacuum chuck rotatably mounted for securing bonded first and second substrates, a rotating member for rotating the vacuum chuck, and a laser for directing a laser beam onto the first and second substrates into cut the substrates held by the vacuum chuck.

Inventors: Yoon; Tae Hwan (Seoul, KR), Kim; Jeong Hyun (Kyonggi-do, KR), Chang; Youn Gyoung (Kyonggi-do, KR)

Assignee: LG. Philips LCD Co., Ltd.

International Classification: C03B 33/07 (20060101); C03B 33/03 (20060101); B23K 26/36 (20060101); B23K 26/16 (20060101); B23K 26/00 (20060101); B23K 26/08 (20060101); C03B 33/09 (20060101); C03B 33/00 (20060101); G02F 1/1333 (20060101); G02F 1/13 (20060101); B23K 026/14 (); B23K 026/16 (); B23K 026/02 ()

Expiration Date: 01/28/2020