Patent Number: 6,512,209

Title: Temperature control apparatus, temperature control method and device

Abstract: A temperature control apparatus, a temperature control method and a device are provided in which the problem of a variation in the operation speed of each device can be alleviated to improve the operation speed of the entire system and reduce failures such as racing, etc., as well as the problem of manufacturing yield for improved reliability in operation, thus contributing to power reduction in temperature control. To this end, a target operating temperature determined based on a target operation speed of each LSI 2 is stored in a ROM 22, and a Peltier element 3 mounted on each LSI 2 is cooled or heated so that the temperature of each LSI2 detected by a temperature detecting section 21 is controlled to a target operating temperature stored in the ROM 22.

Inventors: Yano; Shinsuke (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: G05D 23/19 (20060101); H05B 001/02 ()

Expiration Date: 01/28/2020