Patent Number: 6,512,219

Title: Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area

Abstract: A drop is applied to an active area of an image sensor. A window is pressed into the drop to form a window support. The window support is then cured, or otherwise set-up, to form an image sensor package. During use, radiation is directed at the image sensor package. This radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. The window and the window support are transparent to the radiation.

Inventors: Webster; Steven (Chandler, AZ), Arellano; Tony (Muntinlupa, Metro Manila, PH), Hollaway; Roy Dale (Paranaque Metro Manila, PH)

Assignee: Amkor Technology, Inc.

International Classification: H01L 27/00 (20060101); H01L 027/00 ()

Expiration Date: 01/28/2020