Patent Number: 6,528,866

Title: High-frequency module

Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as "solder touch" between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.

Inventors: Kawanishi; Masato (Hibikino, JP)

Assignee: Sharp Kabushiki Kaisha

International Classification: H05K 9/00 (20060101); H05K 3/30 (20060101); H05K 3/34 (20060101); H01L 023/552 ()

Expiration Date: 03/04/2011