Patent Number: 6,528,869

Title: Semiconductor package with molded substrate and recessed input/output terminals

Abstract: Semiconductor chip packages having molded plastic substrates and recessed I/O terminals are disclosed, along with methods of making such packages. In an exemplary embodiment, the molded plastic substrate includes a metal interconnect pattern and a plurality of indentations in a surface thereof. Each indentation may include at least one projection. The indentation and any projections therein are covered by a metal lining. A metal contact, which serves as an I/O terminal, is placed in each of the indentations and is fused to the metal lining thereof. A chip is mounted on the substrate and is electrically connected to the metal contacts by the interconnect pattern. The package further includes a lid or hardened encapsulant over the chip.

Inventors: Glenn; Thomas P. (Gilbert, AZ), Hollaway; Roy D. (Chandler, AZ)

Assignee: Amkor Technology, Inc.

International Classification: H01L 21/02 (20060101); H01L 23/12 (20060101); H01L 21/48 (20060101); H01L 23/28 (20060101); H01L 23/31 (20060101); H01L 23/498 (20060101); H01L 23/48 (20060101); H01L 23/13 (20060101); H05K 3/34 (20060101); H05K 1/11 (20060101); H01L 023/02 ()

Expiration Date: 03/04/2020