Patent Number: 6,528,870

Title: Semiconductor device having a plurality of stacked wiring boards

Abstract: In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.

Inventors: Fukatsu; Kenta (Fujisawa, JP), Saito; Yasuhito (Yokohama, JP), Arakawa; Masayuki (Yokohama, JP), Iguchi; Tomohiro (Yokohama, JP), Watanabe; Naotake (Yokohama, JP), Fukuchi; Yoshitoshi (Yokohama, JP), Komatsu; Tetsuro (Yokohama, JP)

Assignee: Kabushiki Kaisha Toshiba

International Classification: H01L 25/065 (20060101); H05K 3/36 (20060101); H05K 1/14 (20060101); H05K 3/34 (20060101); H01L 023/02 ()

Expiration Date: 03/04/2011