Patent Number: 6,528,874

Title: Wiring circuit substrate and manufacturing method thereof

Abstract: The present invention prepares a member having a conductor-circuit-formingcopper foil 21 formed on a protrusion-forming copper layer 23 via anetching-barrier layer 22 formed of a different metal. Etching isselectively performed for the protrusion-forming copper foil 21 by usingetchant that does not etch the etching-barrier layer, and protrusions 25are thereby formed. Then, the etching-barrier layer 22 is removed usingetchant that does not etch the copper foil 23 and using the protrusions asmasks. An interlayer-insulating layer 27 is formed on a surface of thecopper foil 23, on which the protrusions 25 are formed, so that theprotrusions are connected to the conductor circuit. Thereby, heights ofthe protrusions are uniformed, and the reliability of connections can beimproved.

Inventors: Iijima; Tomoo (Tokyo, JP), Ohsawa; Masayuki (Tokyo, JP)

Assignee:

International Classification: H05K 3/40 (20060101); H05K 3/06 (20060101); H05K 3/46 (20060101); H01L 023/12 ()

Expiration Date: 03/02015