Patent Number: 6,528,877

Title: Semiconductor component having a chip carrier with openings for making contact

Abstract: A semiconductor component includes a chip carrier having a first surface, a second surface, and openings therein. At least one semiconductor chip is mounted on the chip carrier. Soldering connection points are formed by at least one metal foil that lines the openings and that extends through the openings. Contact-making points are connected to the semiconductor chip and form electrically conductive connections which extend through the openings in the chip carrier to the soldering connection points. A further metal foil is located between the semiconductor chip and the chip carrier and forms a soldering connection point. The openings include at least one opening that is located underneath the semiconductor chip. The further metal foil extends through the opening that is located underneath the semiconductor chip to the first surface and to the second surface.

Inventors: Ernst; Georg (Thalmassing, DE), Zeiler; Thomas (Regensburg, DE)

Assignee: Infineon Technologies AG

International Classification: H01L 23/28 (20060101); H01L 23/31 (20060101); H01L 23/48 (20060101); H01L 23/498 (20060101); H05K 3/34 (20060101); H05K 3/40 (20060101); H01L 023/48 ()

Expiration Date: 03/04/2011