Patent Number: 6,529,025

Title: Electrical continuity enhancement for sockets/contactors

Abstract: A high performance electromechanical device which improves electrical continuity between a device under test (DUT) and a socket (or contactor), ideally suited for, but not limited to, automated semiconductor test. An ultrasonic transducer is incorporated into the test set-up such that its ultrasonic energy is coupled either into the DUT and thereby into the contacts of the socket or is coupled into the contacts of the socket and thereby into the leads (or equivalent I/O) of the DUT. This coupled ultrasonic energy generates a high frequency mechanical wipe action of microscopic amplitude between the contacting surfaces, thereby displacing oxides and other debris from the contact site. This enhances electrical continuity by reducing apparent contact resistance and by reducing the apparent contact resistance force rate. This high frequency/low amplitude mechanical wipe action can be varied and controlled to yield an effective wipe which is from 10 times to 100,000 times greater than the current state of the art.

Inventors: Kline; Eric V. (Stillwater, MN)

Assignee: JohnsTech International Corporation

International Classification: G01R 1/04 (20060101); G01R 1/02 (20060101); G01R 031/02 ()

Expiration Date: 03/04/2020