Patent Number: 6,529,026

Title: Method for fabricating an interconnect for making temporary electrical connections to semiconductor components

Abstract: An interconnect for making temporary electrical connections with semiconductor components includes a substrate with patterns of elastomeric contacts adapted to electrically engage contact locations (e.g., bond pads, solder bumps) on the semiconductor components. The elastomeric contacts can be formed of conductive elastomer materials, such as anisotropic adhesives and silver filled silicone, having metal particles for penetrating the contact locations. The substrate also includes patterns of metal conductors having non-oxidizing contact pads, which provide low resistance bonding surfaces for the elastomeric contacts. A method for fabricating the interconnect includes the step of depositing bumps in a required size and shape using stenciling, screen printing, or other deposition process. Following deposition, the bumps can be cured and planarized to form the elastomeric contacts. During a test procedure, the elastomeric contacts can be loaded in compression to compliantly engage the contact locations.

Inventors: Farnworth; Warren M. (Nampa, ID), Akram; Salman (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: G01R 1/04 (20060101); G01R 1/02 (20060101); H05K 3/40 (20060101); H05K 3/32 (20060101); H05K 3/24 (20060101); G01R 031/02 (); H01R 009/00 (); H01R 012/04 (); H05K 007/12 ()

Expiration Date: 03/04/2020