Patent Number: 6,529,029

Title: Magnetic resonance imaging of semiconductor devices

Abstract: A method for detecting substrate damage in a flip chip die, having a back side and a circuit side, that uses magnetic resonance imaging. The back side of the die is first globally thinned down and a region for examination is selected. A magnetic field is applied to the selected region and then the region is scanned with a magnetic resonance imaging arrangement. A plurality of perturbations are measured to generate an array of perturbation signals, which are then converted to a local susceptibility map of the selected region of the die. The susceptibility map of the selected region is then examined to determine if there is any substrate damage.

Inventors: Bruce; Michael R. (Austin, TX), Birdsley; Jeffrey D. (Austin, TX), Ring; Rosalinda M. (Austin, TX), Goruganthu; Rama R. (Austin, TX), Davis; Brennan V. (Austin, TX)

Assignee: Advanced Micro Devices, Inc

International Classification: G01R 31/303 (20060101); G01R 31/28 (20060101); G01R 031/28 ()

Expiration Date: 03/04/2020