Patent Number: 6,529,105

Title: Process and device for bonding two millimeter elements

Abstract: A device, and a method for making the same, for bonding two millimeter elements, which include a substrate having an upper face and a lower face, a conducting line on the upper face and oriented substantially perpendicular to an edge of the substrate, and two continuous bounding zones on the upper face and along the edge of the substrate, each continuous bounding zone being electrically grounded, and having a length along said edge between about two and about five times the width of the conducting lines.

Inventors: Cachier; Gerard (Bures sur Yvette, FR), Daden; Jean-Yves (Bois Colombes, FR), Grancher; Alain (Vemars, FR)

Assignee: Thomson-CFS

International Classification: H01P 1/04 (20060101); H05K 1/02 (20060101); H05K 1/14 (20060101); H01P 003/08 ()

Expiration Date: 03/04/2020