Patent Number: 6,530,788

Title: Structure of a ball grid array IC socket connection with solder ball

Abstract: A Ball Grid Array IC Socket connection with solder ball is characterized inthat the conductive plate is formed from bendable, flexible conductivethin plate surrounded to form slotted cylindrical tube for the insertionand clipping of IC pins. The slotted cylindrical tube is in the form ofsquare shape, wherein the size of the tube diameter can tightly clip theball wall of a solder ball, such that the tube opening mounted with thesolder ball provides a tight connection. On the other end of the slottedcylindrical tube, remote from the end inserted with IC pins, at a positionabout half the height of the solder ball, an arc-shaped slit is providedso that a blocking plate is joined to the wall of the tube, and theblocking plate touches the top portion of the solder ball.

Inventors: Ju; Ted (Keelung, TW)

Assignee:

International Classification: H05K 7/10 (20060101); H01R 012/00 ()

Expiration Date: 03/12015