Patent Number: 6,612,505

Title: Spraying method of a dispense system

Abstract: A spraying method of a dispense system for preventing residue, wherein a precise amount of stream fluid is supplied from a fluid supply through a main tube to a nozzle, and the precise amount of stream fluid is sprayed onto a surface of a wafer. A sub-tube system, which comprises a bypass valve and a pin hole is utilized to refill the fluid to a void. A metering valve is used as a suck-back system to retrieve the remaining fluid in the main tube and prevent residue from occurring.

Inventors: Shyu; Ching-Shyong (Hsinchu, TW)

Assignee: Winbond Electronics Corp.

International Classification: B05B 9/03 (20060101); H01L 21/00 (20060101); B05B 017/04 (); B05B 001/30 ()

Expiration Date: 09/02/2020