Patent Number: 6,617,197

Title: Multi row leadless leadframe package

Abstract: A packaging arrangement is described that utilizes a conductive panel (such as a leadless leadframe) as its base. The conductive panel has a matrix of device areas that each include a plurality of rows of contacts that are located outside of a die area. Tie bars provide support for the various contacts. Some of the tie bars are arranged to extend between adjacent contacts in the same row and some of the tie bars are arranged to extend diagonally between associated contacts in adjacent rows that are not adjacent one another. During packaging, the tie bars can be severed by cutting along lines (e.g. saw streets) that run adjacent the rows after a molding operation. The described panels are particularly useful in packages having three or more rows of contacts.

Inventors: Bayan; Jaime (Palo Alto, CA), Spalding; Peter Howard (Cupertino, CA)

Assignee: National Semiconductor Corporation

International Classification: H01L 23/48 (20060101); H01L 23/28 (20060101); H01L 23/31 (20060101); H01L 23/495 (20060101); H01L 021/44 (); H01L 021/50 ()

Expiration Date: 09/09/2020