Patent Number: 6,617,201

Title: U-shape tape for BOC FBGA package to improve moldability

Abstract: An FBGA packaged device including a die adhered to a substrate with a smallgap being formed between the die and substrate. An opening is formedthrough the substrate adjacent the center portion of the die. Anencapsulating mold is formed around the die extending into the gap andalso filling the channel. At least one barrier is disposed in the gapbetween the substrate and the die adjacent the channel to control the flowpath of the encapsulating material as the mold is formed in the package.

Inventors: Chye; Lim T. (Singapore, SG), Kuan; Lee C. (Singapore, SG), Toh; Jeffrey (Singapore, SG), Teoh; Tim (Singapore, SG), Guay; Patrick (Singapore, SG), Wah; Choong L. (Singapore, SG)


International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 23/12 (20060101); H01L 23/13 (20060101); H01L 021/44 ()

Expiration Date: 09/02015