Patent Number: 6,617,398

Title: Poly (phenylene ether)--polyvinyl thermosetting resin

Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.

Inventors: Yeager; Gary W. (Schenectady, NY), Colborn; Robert E. (Schenectady, NY)

Assignee: General Electric Company

International Classification: C08G 65/00 (20060101); C08L 71/00 (20060101); C08G 65/48 (20060101); C08L 71/12 (20060101); H05K 1/03 (20060101); C08L 071/12 (); C09D 171/12 ()

Expiration Date: 09/09/2020