Patent Number: 6,637,506

Title: Multi-material heat spreader

Abstract: In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center portion and a perimeter portion. The center portion and the perimeter portions are structurally coupled to each other. In another embodiment, the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.

Inventors: Gektin; Vadim (San Jose, CA), Malladi; Deviprasad (Fremont, CA)

Assignee: Sun Microsystems, Inc.

International Classification: F28F 23/00 (20060101); H01L 23/34 (20060101); H01L 23/433 (20060101); H05K 007/20 ()

Expiration Date: 10/28/2020