Patent Number: 6,637,639

Title: Wire processing apparatus, flux applying device, and solder depositing device

Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.

Inventors: Miyoshi; Akira (Hyogo, JP), Ikeji; Masahiro (Hyogo, JP), Satou; Nobuo (Hyogo, JP), Sakaue; Shigeru (Hyogo, JP), Taniguchi; Tadashi (Hyogo, JP)

Assignee: ShinMaywa Industries, Ltd.

International Classification: B23K 1/20 (20060101); B23K 3/06 (20060101); H01R 43/048 (20060101); H01R 43/04 (20060101); H01R 43/28 (20060101); B23K 001/08 ()

Expiration Date: 10/28/2011