Patent Number: 6,637,641

Title: Systems and methods for manufacturing a circuit board

Abstract: A circuit board manufacturing system has a paste source, a circuit board processing apparatus, and a controller. The circuit board processing apparatus includes a carrier configured to receive a circuit board having (i) a section of circuit board material and (ii) virgin metallic surface mount pads supported by the section of circuit board material. The circuit board processing apparatus further includes a paste distribution assembly coupled to the carrier and to the paste source. The paste distribution assembly is configured to dispose a paste from the paste source onto a surface of the circuit board. The carrier further includes a surfacing assembly coupled to the carrier. The surfacing assembly is configured to move the paste over the surface of the circuit board to remove a portion of each virgin metallic surface mount pad. The controller is configured to selectively start and stop operations of the paste distribution and surfacing assemblies.

Inventors: Downes; Stuart D. (Milford, MA), Liang; Jin (Southborough, MA)

Assignee: EMC Corporation

International Classification: B23K 1/20 (20060101); H05K 3/34 (20060101); H05K 3/26 (20060101); B23K 003/08 ()

Expiration Date: 10/28/2020