Patent Number: 6,670,633

Title: System for split package power and rotational burn-in of a microelectronicdevice

Abstract: A microelectronic device is provided including an integrated circuitmounted to a substrate. A break through multiple conductive layers of thesubstrate corresponds to a break in the power planes of the integratedcircuit. The breaks in the substrate and in the integrated circuit allowfor a rotational burn-in of a first portion and a second portion of theintegrated circuit.

Inventors: Mayberry; Mike (Beaverton, OR)


International Classification: G01R 31/28 (20060101); H01L 023/48 ()

Expiration Date: 12/32016