Patent Number: 6,670,701

Title: Semiconductor module and electronic component

Abstract: A semiconductor module achieving higher density of the semiconductor module itself as well as of being disposed in an area-efficient manner relative to another electronic component, such as a mother board and the like. The semiconductor module includes a mounting substrate having, on an underside, a solder ball for connecting to an interconnection of a mother board and semiconductor packages mounted in multiple layers on the top side of the mounting substrate and connected to electrodes on the mounting substrate.

Inventors: Matsuura; Tetsuya (Hyogo, JP), Kasatani; Yasushi (Hyogo, JP), Michii; Kazunari (Hyogo, JP), Maeda; Hajime (Hyogo, JP)

Assignee: Mitsubishi Denki Kabushiki Kaisha

International Classification: H01L 25/065 (20060101); H05K 1/14 (20060101); H05K 3/34 (20060101); H05K 1/18 (20060101); H01L 023/02 ()

Expiration Date: 12/30/2020